Gadgetory

just like with KB Lake before we'll probably be talking about risin and then for the next few weeks on and off at least because there's a lot of information to work through and we've only just begun to really get to the surface of what will eventually be out there for an for its chipsets and the rise in CPU and any other cps that would follow for today we're focusing on the chipset so we'll be talking about m4 and it's X 370 be 350 a 320 X 300 and a B 300 chipsets pretty basic at a top level but before getting to that this coverage is brought to you by cyber power and there's cyber XL gaming PC which at CES we saw one with a risin logo on the side of it you can learn more in the link in the description below before getting to the chipsets we need to cover some of the basics with the CPU here's a graphic that we made to better illustrate the blocked layout of risin the current rise in CPU as we know it will host a total of 16 PCIe gen3 lanes and that's what's available for your graphics devices another set of 4 PCIe lanes will go straight to the chipset which are then divvied out to general-purpose PCIe Gen 2 or 2 USB 3.1 and USB 2.0 the CPU also hosts capacity to fuel for USB 3.1 gen2 online including options to peel those off for SD and external devices further the CPU can either choose a B or C and our graphic and that'd be either 2 SATA plus 1 by 2 nvme slot 2 SATA plus 1 by 2 general-purpose PCIe set of lanes or 1 by 4 nvme set of lanes it's one of the three can't have multiples multi GPU support is possible through 2 by 8 PCIe lanes that come off of the CPU so this would all be gen 3 at this point and you could also do some muxing as we saw with some of the X 370 boards at CES last week that would include MSI's titanium X power board which uses a set of MUX or chips to somehow better enable multi GPU we'll have to actually test it to see how it works of course as always but the idea is that X 370 supports multi GPU you run by 8 and by 8 for the two slots and most of the slots are electrically wired for by 16 by 8 and by for the now which boards you're looking at be 350 will not support multi-gpu and he just doesn't see it as a reasonable device to sport because they figure anyone with two or more video cards is probably going to be on a higher-end motherboard and I can't say that I argue too much with that of course it's always nice to have the option but they're just supporting X 370 for multigp for now and that does kind of make sense the overclocking potential it's available on X 370 and beat 350 there might be some caveats there we'll explore later X 300 also has overclocking abilities talk about that in a moment a 320 and 8 300 and or a B 300 as they call it will not be overclocking ready so be 350 yes x3 70s X 300 yes and then everything else no overclocking there are two core chipsets two am four for our audience X 370 and B 350 will be the main ones that deserve immediate focus X 370 can be thought of somewhat as comparable to the previous 990 FX line or to the current disease series of Intel chipsets in terms of its market positioning the chipset immediately differentiates itself from B 350 by enabling a 2x8 multi GPU support but should theoretically retain the same level overclocking as B 350 because the CPU itself contains so much of the i/o now effectively SOC in status the chipset doesn't really do much other than add a few more lanes and it's really just a few X 370 offers eight PCIe gen 2 lanes where B through 50 runs six PCIe gen two lanes so two fewer and X 370 also has an additional four USB 3.1 gen2 on ports which are effectively USB 3.0 with a few changes and should generally run wire into PCIe devices that consists of again by 16 byte and by 4 where three slots are present as for SATA Express these lines are more meant for use as either 2 SATA 3 ports or 2 PCIe gen3 lanes general-purpose mostly because actual SATA Express isn't really expected to be used no one buys SSDs that you say to Express at this point as for overclocking again it should be the same on both platforms front we're told but Andy's marketing sheet does have an extra really tiny footnote on the X 370 with overclocking and that note would seem to indicate that better thermal solutions are required for X 370 overclocking as opposed to be 350 the main reason I would think something like that would happen would be if additional options were enabled on X 370 that might not be elsewhere which could potentially drive up the heat but we'll have to actually see the boards or the chipsets to understand if there's anything to that other than just someone slipped up and forgot to apply the footnote to both devices as for X 300 that's an incredibly small chip set it allows for higher end rise in CPUs to do what they're meant to do which would be multi-gpu if you wanted to they run at full tilt their overclock we'll all that stuff but X 300 is meant for use in Mini ITX systems it's an SFF chipset and in size it's about the size of a pinky now for what we're told so it's pretty damn small that means two things one it doesn't really do any i/o the only purpose of that chipset other than to just enable Rison to do what it can natively do is to allow us to cure boot other than that there's not a whole lot going on it's all the iOS handled through the CPU but the X 300 version does allow unlocked overclocking where the a B 300 solutions do not and it also kind of oddly allows for multi GPU which is basically totally irrelevant because no Mini ITX motherboard is going to support two PCIe full length slots for GPUs but it's still allowed so I guess if you put an X 300 chipset on micro ATX for some reason then you can still do multi-gpu that said these sub the smaller form factor and position of the X 300 chipset does mean that in theory this frees up some space on the motherboard so either some sis or system builders could go do some kind of proprietary small form-factor motherboard and cut off maybe an inch or two squared of space or they could just fit another m2 device onto the motherboard or more SATA or something like that because the chips that will not take up much space even stuff like more USB 2.0 headers which is always really something I want on many boards and is never there so that's potentially good for Andy to have that smaller SFF targeted chipset we haven't seen any in person yet they didn't have any at CES alongside the micro ATX and ATX boards but that's the basics for it so I think that pretty much covers a B 300 are the lower end s of F SKUs no overclocking no multi GPU support although mostly irrelevant anyway and that is about everything we have so chipsets for m4 are going to be pretty simple compared to what we've seen previously the CPU largely will dictate what you can do with your motherboard end system as a whole because it's handling so much of the i/o now that would include again USB PCIe for the video card with no PCIe three lanes as fallback and the chipset none at all all the PCIe three lanes on the chipset there's about four being sent to it from the CPU then those are divvied up among other i/o devices so you're getting your graphics from the CPU 16 lanes there that means you can split it into two by eight so it's really quite simple this time just more than previously pay attention to the CPU you're buying because this idea of I'll buy a good motherboard now upgrade later and retain all the same support isn't going to work quite the same way as it has in the past so buy a CPU that will support out of box everything you want in terms of i/o then the chipset will do a little bit for you but not a whole lot thank you for watching that's all we have for you right now check the channel for motherboard coverage gamers Nexus not match for additional coverage from CES that did not make to the YouTube channel subscribe for more patreon link in the post roll video to help us that directly thank you for watching I'll see you all next time you