Gadgetory

everyone welcome back to another hardware news recap for the week this week includes the word cryogenic so Intel working on a cryogenic way for over more future-looking technology but really cool to talk about ddr5 investments being made by SK Hynix we've been talking about these for a while now but it's getting more serious as time goes on ice lake rumors for a June launch and low-end touring options could be coming later this year not that surprising but one of them does include a GTX 16:50 continuing and video set naming scheme and then finally GN we have a trip to Taiwan and China coming up but this is not Computex this time so we'll be leaving within a couple days here when this video goes live or might be gone by the time the video goes live so andrew and i will be in asia working on factory tours and we'll talk about that as well before that this video is brought to you by iFixit and the manta driver kit the iFixit manta driver kit is built out as a generalized tool for repairs of all types with a focus on game console repairs by including those strange proprietary bits phone repair bits laptop repair bits and more the Betts a driver kit includes tri Wayne bits spanners positive Drive game bits torch Security bits and everything else for general tech repair click the link below to learn more dodge ahau judge or moral woman to Ty Bay hood don't go con wanton so this weekend we are flying to Taiwan and China really looking at some factories they're doing some factory tours with several of the companies that you all know and like or maybe dislike their products should be pretty fun we do this typically around Computex this time we're going a bit earlier and I know I can say for fact we're visiting a few board partners we are visiting EVGA and Taiwan for example we'll be seeing them and hopefully kingpin so you might have them on camera will see and should have some really fun projects with him as well and then we'll be visiting factories for I don't know which ones I can name and can't but for sure I can say we will be visiting factories for at least one to two board partners and I am pretty sure we're gonna have videos we can publish on them so you'll be able to see some stuff about modern videos from us on how video cards how other boards are made hopefully and we have some old stuff but things have changed a bit on the lines of the last few years so we show that and then some videos on some case cooling maybe power component manufacturing as well so definitely if you're not subscribed to make sure you are check back regularly over the next two weeks or so we'll be there and publishing content and hopefully we'll see how well I mean YouTube and firewalls and China might be a bit of a challenge but we'll see so yeah check back and I think other than that you will probably want to see the KP content so kingpin I'm not a hundred percent sure what we're doing yet but I do have an idea and some of it might involve like custom mods from him or custom equipment from him to make mods in a sort of automatic fashion so we'll see I was instructed to bring the most expensive processor I have and hopefully he will not destroy it I think should be a lot of fun so make sure you check back and then also very quick just mention for those of you who saw the stream with Joe step on Z when he joined me on stream a couple of people made up the captain overclock character which was supposed to be a combination of I suppose my sullivan of joe and we have some fanart i think two people may be submitted fan art of captain overclock and we'll just put those on screen so thank you for sending those in we we got a good good laugh out of them and they're extremely talented pieces of art so thank you for sending those in and we did get in touch with people and offer some free merch one of you turned it down but if you do want it let me know in the future so first real news item here other than the trip to taipei and and china is the cryogenic wafer prober which is intel's new tool for quantum chips and actually maybe we can for the editors here maybe we can get a shot of our own waferpro where we actually have one it's not a cryogenic one but we have a wafer per over that that we picked up from one of the fabs when it was retired so i can show you what one of those looks like for the sort of older method of probing wafers this one that was different this is built in collaboration between Intel boof blue first I think and a four a four I'm not sure how to pronounce the name but it is built in collaboration with these companies it's a big step forward for mainstream quantum chip production and it allows for testing of qubits before they're manufactured this is similar to how regular silicon transistors are tested and validated before going into further production steps and obviously into the chip itself so currently quantum chips are tested at at very low temperatures and they're tested at these low temperatures for potentially several months to validate that it works and after the manufacturing process the is when the testing occurs for quantum chips as opposed to regular silicon being assessed sort of within the manufacturing within the fabrication process in a matter of hours or less depending on the complexity of the design so hours or less versus months for quantum chips and this is supposed to resolve some of that issue of time and the new cryogenic wafer prober it looks like low-level manufacturing level testing will be much quicker with correction of errors in production as opposed to after production and it's a bigger step towards pushing quantum computing closer to volume production there's a quote here from dr. Jim Clark director of quantum hardware at Intel who said quote so far the past year Intel has worked with blue freeze and afford to combine our expertise and build a fast electrical characterization tool that can operate in the quantum regime we hope that by designing this tool the industry can use it to accelerate the progress of quantum computing the cryogenic wafer prober will reside at Intel's Oregon campus which as we've reported is getting major up fits we've talked about this last few weeks now so Oregon campus will have it to allow scientists more accurately test the qubits on the 300 millimeter wafers down to temperatures of only a few Kelvin so according to early testing and quote the tool has a novel ability to collect high volume cryogenic data and create a statistical correlation of the increase in turn-on voltage between room temperature and cryogenic temperature with this tool Intel will be able to speed a feed back into the silicon spin qubit fabrication line and accelerate quantum computing research and development and quantum computing of course still a very new field not one that we know very much about but one that is very interesting to follow so in towns got a newsroom post if you want some more information quotes on that but not a ton of really technical details just yet next one SK Hynix fab investments and the first ddr5 chip we've talked about this one before despite DRAM prices being on the decline as we reported last week this is good news for our section of the industry SK Hynix remains optimistic that at some point business will once again be booming and so what SK Hynix is doing right now is investing or preparing to invest 107 billion dollars in for fabrication plants across South Korea additionally 49 million dollars will be set aside for upgrading existing facilities just some pocket change from SK Hynix the company plans to spread its financial outlay over the next 10 years and this is as it expects growth for DRAM to increase with thanks to AI and deep learning applications in other SK Hynix news the company recently DS held its first ddr5 chip we've talked about these in the past the ddr 5 6400 chip is a 16 gigabit part and it is supposed to operate at 6400 mega transfers per second with a voltage of at one point one volts pretty good reduction over the previous ddr4 modules the memory is produced using SK Hynix is second generation 10 nanometer class of fabrication process and according to the company a hynix chip designer dong-hyun Kim said that SK Hynix has to implement a new delay it locked loop or a DLL that uses a phase rotator and an injection locked oscillator as well as a modified forward feedback equalization or FF II circuit and apparently in plain English these additions are supposed to ensure reliability of operation at the higher frequencies and offset clock related issues associated with those high frequencies so we'll hopefully at some point we'll get a chance to speak with some of the engineers about what these words mean in the sequence that they are in because frankly this is not stuff we're very familiar with that at a super low level so we're hoping to talk to some of them at some point but for now DDR 5 is still on the horizon the spec has been ratified for a while now and it's just a matter of in a platform and then getting chips and modules to mass production separately in terms of DRAM pricing typically you see this cycle in the DRAM market and this is just going off-script a bit here but typically you see a cycle where as investment into fabrication plants and technology Rises the price of DRAM will also in a latent fashion also rise so be a bit delayed but it will rise as well and the traditional reasoning for that is because the companies are not investing as much of their money into supply so there's not as much oversupply like we have right now which is kind of bad thing for them anyway and so instead investing money into technology and that in result drives down the supply available as demand remains at least the same if not rising and so you end up with the prices going back up so prices are on a decline right now but if all the companies start focusing their investment into technology and thus drive down their supply the cost per gigabyte as an average will go up and that is a historical trend that has been true for for at least a decade so so that is probably what's gonna happen here all the companies start invest and there's only three big DRAM suppliers so if they all do this at the same time then that's what will happen the price they'll go up if one of them decides to break rank and produce oversupply and undercut the rest of them then obviously that's good for us and that's kind of how the market should work but doesn't always next up rumors ice lake in june intel's next architecture or next processors according to leaked to lenovo documents intel's most frequently kerr of documents that appeared on the / r / synced pad subreddit apparently it's a thing it must be a fun place intel's wall delayed 10 nanometer ice lake could appear as early as June of this year which is really not all that surprising but it would be a bit ahead of the intel holiday 2019 projection from earlier if it happens so this is still sort of a rumor but it's also leaked documents from Lenovo M&O goes down this several times in Thailand Nvidia over the past two or three years now and they've typically been accurate so of the documents it indicates that lenovo will be refreshing its x1 yoga line with ice lake core i5 and i7 parts and these new models will allegedly arrive in june of 2019 meanwhile in August of 2019 lenovo is planning a refresh for its x1 carbon line and this should also again use ice lake processors and as with all the leaks and rumors usual prescribed amounts of salt but this one you could probably probably prescribe a little bit less low and Taurean options could be coming later this year and we have I guess will bundle one other news item in here that's kind of brief let's start with with the one that I just saw before starting the video there's a gtx 1650 rumored to come out and i think that comes from a tweet from an industry analyst of sorts so there's a 1650 that's rumored and we'll put his tweet up on the screen it's supposed to have 4 gigabytes of memory has supposed to be below the rumored 1616 on t Ice Cube and we have yet to see a 2 gigabyte model of the touring GPUs so we'll see if that that sort of memory capacity dies off with time but following the release of the Elan awaited and rumored 1660 Ti digit times is now reporting that Nvidia is planning to further flesh out its during low end and digit time says quote NVIDIA is set to release two more medium and low end graphics cards in the second quarter of 2019 as part of its efforts to enhance its presence in the GPU market and dampen competition according to the article and we'll have a link to them in the show notes below the 1660 should be a march 15 release in theory the 1650 would be April 30th and the minimum price tags will be 230 $180 respectively and then specifically here and and sort of interesting the report states that Nvidia wishes to keep AMD's market share under 25% and preferably under 20% if possible according to the digitized reporting now presumably and video would also like to keep AMD's market share close to 0% so none of this is really that surprising but supposedly the new Torian options are tended to put pressure specifically on an these mid-range low-end cards and also Vegas 64 from the top with some of the more recent launches like the the 2070 2060 things like that so and he's gonna have pressure now from the 570 up to Vega 64 at this point and then Radeon 7 might be doing the opposite applying some pressure to RTX 2080 and we'll be talking about that part more in the future next up del del NT 20 legacy of good plan del has never been that great at making these types of names del is proud to announce its ability to recycle 2 billion pounds of e ways so del is ahead of its target originally a plan to recycle 2 billion pounds of e-waste by 2020 so as the del newsroom announcements and PR statements imply it looks like del is working with some companies to convert diesel engine exhaust into printing ink sort of an interesting investment there and this is from the vice president of engineering with client Solutions Group at Dell and the head of Dell TDC or Taiwan development Design Center as I call it now so della is also allegedly the first and maybe the only vendor actual like vendor of parts to recycle gold from motherboards and reuse it Dell also continues to collect the recycled electronic materials and adapt them to its product lines and the company is aiming to see 100 million recycled materials by 2019 by April actually so some good news I guess on the reusability front and sustainability of computer hardware and electronics next one spaceborne that computer is still operational after 530 days being stranded in space the pair of HPE Linux based servers collectively known as the space born computer were sent up to the international space station in August of 2017 now after more than 530 days up in space and three months after the planned October 2018 return the computers are still operational the servers which are capable of super computer processing power were part of an experiment to see how durable they would be in space quote without specialist treatment HPE senior content architect Adrian Kaz Bergen told BBC that they could return in June of 2019 and that they have mostly functioned without issue according to a Kaz Bergen though there have been some issues with the redundancy power supply and the solid state drives however they are corrected by the autonomous management software and were part of the experiment HPE is currently working with NASA in preparation for the plans of 2030 Mars flight as well as working with Elon Musk's space X which also just recently got green lights from NASA to do some more launches and then the final news item is one that you've likely seen by the time you're seeing our video but might as well throw our hat in the ring USB if' announces its new USB 3.2 terrible standard and let's just kind of do the same thing as I'm sure all the other news reports are doing go back through history a little bit USB 3.0 meant USB 3.0 originally and it later was rebranded to be USB 3.1 gen2 on so the dot o was dropped there is technically no more USB 3.0 it doesn't exist it became 3.1 Gen 1 no change to the spec and and then there were say USB 3.1 gen2 is a bit faster speed and kind of a significant enough way that it might have deserved a different version number or something and then now there's a USB 3.2 so it's not the 3.1 gen2 that's already a thing and it's off 3.1 gen 3 its 3.2 and here's the good part USB 3.0 which became USB 3.1 gen2 on is now becoming USB 3.0 gen 1 and then USB 3.2 sorry 3.1 gen2 excuse me that was an egregious error 3.1 gen2 is now being rebranded as USB 3.2 Jen - of course that's what you do and then the last one is USB 3.2 Gen 2 by 2 or 2 X 2 if you prefer which is apparently I guess because USB 3.2 has double the throughput of USB 3.1 gen2 which is now USB 3.0 Gen 2 I think that's right yes yes yeah 3.1 becomes 3.2 10t yes so then 2x2 is the doubling of throughput of that and so Eric Hamilton wrote writes our news recaps here and sometimes has some some pretty funny quips in here and this one was just simply to avoid confusing consumers parentheses too late the USP I have suggested the use of marketing terms such as super speed USB parentheses USB 3.0 on SuperSpeed 10 gigabit per second USB 3 2010 2 and SuperSpeed 20 gigabits per second USB 3.2 Gen 2 by 2 and to kind of echo some of the concerns from our peers in the industry one of the main ones is as a consumer just an average consumer not most of you average consumer who is trying to get a faster not USB to device and get up to speed now is going to be sorting through content how-to guides or explanations of what's three point over is three point one and all of that information is now wrong so because the USB if' has rebranded everything everything we've ever written in any anything anyone else has ever written using the old names 3.0 3.1 and so forth that's all now incorrect and obsolete because the names have changed which is just completely insane so I am positive us pif has received the memo ah and Linus - give him a shout-out also talked about this and tech tech linked and I'm sure they received the memo I'm also sure that's not a change and if it does it'll probably be worse so anyway that's it for this week we look forward to reporting on USB 3.3 gen 1 through 3 which will be 3.0 3.1 gen 1 2 & 3 point 2 gen 1 & 2 in the next week's episode and check back when we're in China we will have in Taiwan we'll have a lot of cool content there subscribe for more go to store documents access net to pick of a blue print shirt like this one or patreon.com/scishow and exit out there as well thanks for watching see you all next time