Gadgetory

hey everyone welcome back to another hardware news recap to the past week the last couple days have been very heavy in the Vega Department we've got Vega Fe right here review just went live so if you haven't seen it check that out so Vega dominates a lot of the news cycle for the past couple days there aren't too many other topics but there are some important ones for example the rise in proline from AMD and then an on AMD news there's also a new Western Digital 96 layer NAND coming out and then Toshiba's new 4-bit Purcell flash we'll be talking about those along with some product launches for this week's recap before that this coverage is brought to you by the core G 21 enclosure from thermal take a $70 case with two four millimeters thick tempered glass side panels mesh ventilation in the front for breathability a rarity in cases these days and a power supply shroud with top mounted SSD sled learn more at the link in the description below before getting started a couple of notes about the Vega EFI review the written review had a couple of extra lines in the conclusion that were important and I wanted to bring them up in video form as well for the video audience first of all for as stated in both forms of review Vega EFI is not the best tool to try and extrapolate performance of RX Vega there are too many variables still it's best as I stated in the video review to just have no expectations for rx Vega wait for it to launch and then we'll see if it's surprising or not at that time but ideally no expectations going into it for example there are still a lot of comments out there that are like RX Vega is going to be 30 to 40 percent faster it's just just maybe let's temper those a little bit so that there's not a big wave of disappointment because people have hype themselves up really based on no official information other than kind of speculation rumors and things like that so just a note on that again we'll look at our x-ray go when it's time to do so but until that point no no real point in trying to speculate how it will perform other notes on Vega F e again it is in need of some driver updates with blender I wanted to point this out so blender we had issues with it crashing initially and the crashes were not the desktop it was just it was a system pain and then either a blue screen or just a black screen basically a shutdown event where you have to do a cold do from that point and we were able to somewhat work that out by working with the blender foundation one of their cycles coders through reddit messaging and kind of work it out get it working on time for the review got a render done the numbers are in so we have all the data but it still seems a little bit buggy in our work with it and it's really I really can't say if it's blender or if it's drivers at this point because a system hain could be a kernel event or a crash could be a blender event it's it's really hard to say right now but we're still having some issues so the point being that as stated in the review the blender testing could improve going forward at least instability we're not sure about performance performance could very well be the same but there are a lot of different things that you can render and with some specific types of rendering processes within blender for example the tracing transparent shadows and working with that fur on one of the monkeys that we render could be causing a challenge for Vega specifically and that might be leading to a kernel level crash or system hain so we're still looking into that still talking with the blender foundation hopefully AMD will we'll be able to provide some official information as well at some point once they've gotten a chance to look at it on their end it is a long weekend though but that's kind of updates on all that stuff otherwise we do have initial numbers for you in the review if you're curious for more about blender but hopefully we can do a lot more with it soon once it's more stable so next topic the first real topic for the last week of hardware news micron is a set to discontinue the XR brand probably haven't heard Lexar too much lately but it's been in the industry a while and micron owns it and they're looking to discontinue it Lexar was bought from cirrus logic in 1996 and subsequently acquired by micron in 2006 the discontinuation of Lexar is part of micron strategy to increase quote opportunities and higher value markets and channels or said in another way focus on products with higher profit margins micron has vowed to support existing LexArts during the transition but it looks like the company will be going away also interesting Toshiba has started producing qlc or quad level cell 3 diene and chips these will have 16 charge levels so that doubles what a 3 bit PLC module would have or NAND flash and many news outlets are saying that this is an alternative coming forward for TLC for dust cob use it's still a bit early to say if that's actually going to be the case but either way qlc is in production and research from Toshiba at this time and the biggest thing to look out for will be more limited PE cycles or program arrays cycles which are estimated to be between 100 and 150 quite a bit lower than what we've seen with mlc for instance moreover qlc will require an advanced controller different monitoring and error correction initially Toshiba sat qlc will focus on worm or write once read many tasks the new flash dies hold 768 Giga bits or 96 gigabytes and a 64 layer stack so 1/16 I stack could offer 1.5 terabytes of storage toshiba has revealed plans for qlc SSDs offering 100 terabytes of data capacity and this tags along with really everything else we already know about flash which is as you as you add more layers to the cell or more levels to sell and you increase the charge level you lose endurance but you gain capacity at a lower cost hence the lower PE cycles but the greater endurance again looking at a 16 die stack being 1.5 terabytes or thereabout so there's no word on endurance right now no real word on performance either in terms of the speeds but for the time being the new flash will probably be aimed at data center and enterprise where again they are writing one time and reading a whole lot so back up basically or just very rarely ever programmed and erased more than a couple times so she was planning to give us more information at the next flash memory summit or MMS in August of this year Western Digital alongside Toshiba as part of their joint venture announced BICS for NAND or bit costs scaling that NAND at slash technology with new chips using 96 layers Western Digital noon and will include several configuration capacities and we'll use TLC and qlc architectures speaking of presently 96 layers is the largest layer count in the industry and WD plans to offer components that are both TLC and qlc based with capacities ranging from 256 gigabytes to one terabyte as previously stated it's reasonable to expect that the qlc configs will be suited for data center and enterprise applications more so than consumer WD plans to sample select 96 layer B ICS for dyes by the second half of this year with mass production slated for 2018 like Toshiba Western Digital plans to offer more information also at flash memory summit 2017 in August with Vega being the focus lately it feels like it's been a long time since risin came out but that's actually not the case Rison pro is slated to be the next align that Andy is pushing and this will introduce six new SKUs and the risin family they are business targeted as indicated by the pro moniker and the biggest changes here are advanced security measures so they're for again business is not something that a consumer would make use of and then a different hypervisor setup better manageability for enterprise and b2b type work reliability and extended warranty and then what what AMD says is improved silicon quality we don't really have any actual measurements of that or what exactly that means but basically it sounds like more hand selected or at least semi binned or tested chips for risin Pro Rison Pro is expected to start rolling out in fall and it looks like the main chips of note that we should be interested in are probably the rise in three units because we haven't actually seen those on the desktop side yet so for risin three they've got risin three Pro 1,300 announced and risin three at Pro 1200 announced following the 1,500 1,400 of risin 5 and those are both for core 4 thread parts they boost 2 for the 1200 3 point 4 gigahertz and for the 1300 unit they boost it boosts to 3.7 gigahertz with the rest of the units being familiar so Rison pro 17 X is 8 core 16 threads as we know from the 1700 X non-pro still at 3.5 3.7 gigahertz so familiar clock speed risin pros 1700 3 gigahertz and 3.7 gigahertz boost also 8 cores 16 threads and then risin 5 is familiar here as well so all the parts will be 65 watts except the 1700 X which remains 95 watts as the non-pro unit does moving into product launches that were announced in the past week one of the big ones is intel's 545 series SSDs these are the first 64 layer PLC 3d NAND SSDs coming to market and they use a floating gate architecture the Intel 545 series will use an SMI controller or silicon motion and that's the SM 2259 for the controller it looks like it will be a 2.5 inch form factor for SATA but m dot 2 variants are expected to exist as well the Intel 545 s will launch in a 512 gigabyte capacity for $180 and the drive will come with a five-year warranty finally getting into peripherals there are a couple of new Mike's coming out MSI's got a new clutch gaming mouse and Thermaltake has the Nemesis switch these follows the biggest Mouse launches of the year from a Logitech coarser and Razer with a Logitech using a magnetic resonance charging surface that goes with the new G 903 or whatever it's called that follows the G 900 series that was one of the biggest ones now for cheaper options there's a TT eSports nemesis switch it's called which is supposedly a $50 cheap RGB entry-level MOBA and MMO Mouse focusing on macros and switches for the most part uses a BMW 3360 sensor and that tops out at 12,000 dpi of course that's not the only measurement you also care about things like IPs but the mouse uses a pretty standard 50 million click on Ron switch they're used in a lot of things these days really second to the 20 million switches in popularity for mice and they have 12 programmable buttons on the mouse with 5 profiles the interesting thing is that although there are 12 switches on the Thermaltake nemesis switch Mouse they have four that are sort of hidden within the so these switches can be basically rolled into place while eight are moved round in the nice body and we'll have some photos to show that off for you but the other mouse the MSI clutch Gaming Mouse is the clutch GM 60 it follows a line that MSI already launched a Maasai not necessarily known for peripherals really at all but everyone has to make them now so they're using a PMW 33:30 sensor and there's 10k dpi sensor and its counterpart the GM 70 uses a pmw 3360 sensor both mice offer dpi stepping and one hundred dpi increment and run a 1000 to 3000 Hertz polling rate no word on price for the msi clutch mice but they should be coming out in July where thermal takes nemesis switch coming out in quarter three of this year so that's all for this news roundup as always you can subscribe to catch more when we work in order this card's throughout the week and go to store doc gamers Nexus nice to pick up a shirt like this one or patreon.com/scishow nice to tell us that directly thanks for watching I'll see you all next time you